Electronic Packaging Laboratory
About Us
People
Staff
Research Students
Services
Equipment
Sample Preparation
Processing and Assembly
Material Characterization
Opto-Electrical Characterization
Mechanical Reliability Test
Long Term Reliability Test
Failure Analysis
3D Printing
Other
Partners @ HKUST
Equipment Booking
Download Area
Contact Us
Equipment:
Processing and Assembly
Home
Equipment: Processing and Assembly
4-zone Reflow Oven
6-Zone Reflow Oven
Vacuum Reflow Oven
Transfer Molding Machine
Manual Flip Chip Bonder
Wafer Saw
Laser Wafer Scriber
Wire Bonder
SMT Printer
