Equipment Processing and Assembly

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Laser Wafer Scriber

Delphi Laser

• For non-contact wafer dicing, die separation, etc.
• Scribing depth: ~50 um
• Scribing line width: 5~10 um
• Maximum size: 6" wafer
• Wafer material: Saphhire, quartz, silicon, etc.

Categories

• Sample Preparation
• Processing and Assembly
• Material Characterization
• Opto-Electrical Characterization
• Mechanical Reliability Test
• Long Term Reliability Test
• Failure Analysis
• 3D printing

Equipment

• Wafer Saw
• Laser Wafer Scriber
• Manual Flip Chip Bonder
• Wire Bonder
• Transfer Molding Machine
• 4-zone Reflow Oven
• 6-zone Reflow Oven
• Vacuum Reflow Oven
• SMT Printer