Equipment Processing and Assembly

Manual Flip Chip Bonder

Manual Flip Chip Bonder

FINEPLACER 96 "Lambda"

  • Bonding accuracy: 0.5 μm
  • Max. die/package size: 16 mm (pick-n-place only)
  • Min. die/package size: 0.5 mm
  • Substrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)
  • Bonding environment: nitrogen / formic acid
  • Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N), reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic