Equipment Processing and Assembly
Manual Flip Chip Bonder
FINEPLACER 96 "Lambda"
- Bonding accuracy: 0.5 μm
- Max. die/package size: 16 mm (pick-n-place only)
- Min. die/package size: 0.5 mm
- Substrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)
- Bonding environment: nitrogen / formic acid
- Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N), reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic