Prof. S. W. Ricky Lee

Prof. Shi-Wei Ricky Lee


Email:; Tel: (852) 2358 7203

Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for three years. Currently Dr Lee is Chair Professor of Mechanical and Aerospace Engineering (MAE) and Director of HKUST Foshan Research Institute for Smart Manufacturing (FRISM) at HKUST. He also has concurrent appointments as Acting Dean of Systems Hub of HKUST Guangzhou campus, Executive Director of HKUST Shenzhen Platform Development Office, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Dr Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. His R&D activities cover wafer level packaging for heterogeneous integration, additive manufacturing for microsystems, LED packaging, and reliability engineering. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 3 books and 9 book chapters. Due to his technical contributions, Dr Lee received many honours and awards over the years. Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He also serves as Editor-in-Chief of ASME Journal of Electronic Packaging.

Dr. Mian Tao

Chief Technical Officer

Email:; Tel: (852) 2358 8444

Mian Tao received his MSc degree from the Hong Kong University of Science and Technology (HKUST) in Mechanical Engineering in 2010 and PhD degree in 2016. His research interests include thermal characterization and management of high power electronics and development of advanced microelectronic packages.

Dr. Xing Qiu

Senior Technical Officer

Email:; Tel: (852) 2358 8444

He received his B.Eng degree at Jilin University in Mechanical Engineering and Automation in June 2013 and PhD degree at HKUST in March 2020. He joined EPACK Lab since September 2014, starting the PhD research with developing additive manufacturing processes for electronic packaging applications. He was granted the ICEPT Outstanding Paper Award in 2021 and 2022, ICEP Outstanding Technical Paper Award in 2021, IEEE EPS Japan Chapter Young Award in 2019 and IPC Dieter Bergman Scholarship also in 2019. He was awarded NSFC Youth Fund in 2022. He has published more than 20 papers and 1 patent. His current research interests include additive manufacturing for chip level packaging and UVC LED packaging.

Dr. Yuanjie Cheng

Senior Technical Officer

Email:; Tel: (852) 5939 7837

Yuanjie Cheng completed Ph.D. in Mechanical and Aerospace Engineering at Hong Kong University of Science and Technology (HKUST) in 2022. His dissertation research focused on quantum dot color conversion materials for mini/micro-LED displays. He was granted Outstanding Paper Award of ICEPT2021 and Outstanding Technical Paper Award of ICEP2021 in 2021. He also involved in many microelectronics packaging projects, including thermal interface material for packaging, 3D hybrid bonding interconnection, and fabrication of micro-LED display.

Dr. Hua Xu

Senior Technical Officer

Email:; Tel: (852) 2358 8444

Hua XU received his Ph.D. degree in Mechanical and Aerospace Engineering from the Hong Kong University of Science and Technology (HKUST) in 2022. He focused on the joint properties of face-to-face synthesized carbon nanotubes for thermal management in 3D stacked IC packaging in his Ph.D. study. He was a research assistant in the Electronic Packaging Laboratory (EPACK Lab) in HKUST since 2019. Currently, he is a research associate in the lab and is in charge of various packaging-related projects, including reliability tests, biocompatible packaging development, thermal modeling and characterization.