Equipment Processing and Assembly

Bonding area:

• Work holder: 6" x 4" (150 mm x 100 mm), max 200℃
• Adjustable height: 0.625" (15.9 mm)
• Max bond span: 0.349" (8.9 mm)

Bonding parameters:

• Bond force: 10 g-250 g (low/high programmable)
• Bond time: 0 ms-999 ms
• Programmable: 40 device with 30 wire types, up to 5 bonds per wire, individual power, time and loop control data per wire type
• Ultrasonics: 63 kHz, 2.5 W

Wire capability:

• Au/Al: 0.7 mil - 3 mil (18 μm - 75 μm)
• Cu: 0.7 mil - 1.5mil (18 μm - 38 μm)
• Ribbon: 0.5 x 2 mil - 1 x 10 mil (12.5 x 50 μm - 25 x 250 μm)