About Us

EPACK Lab is a R&D center in the Hong Kong University of Science and Technology (HKUST). We offer professional services and trainings to companies and industries. We cooperate with companies on technology transfer and R&D projects related to advanced microsystems packaging. We provide supports to the research activitiesin the unveristy.


Wafer Level Processes
Chip/Package Level Processes
Board Level Processes
Material Characterizations & Inspection
Reliability Assessment
Failure Analysis
Optical/Thermal Characterizations


Processing and Assembly
Sample Preparation
Material Characterization
Optical & Electrical Charaterization
Reliability Accessment
Failure Analysis

General Enquiry

Dr. Mian TAO 
Tel: (852) 2358 8356  
Email: epmian@ust.hk

Room 2162, EPACK Lab,
Hong Kong University of Science and Techology,
Clear Water Bay, Kowloon, Hong Kong SAR

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