About Us

CAMP is a R&D center in the Hong Kong University of Science and Technology (HKUST). We offer professional services and trainings to companies and industries. We cooperate with companies on technology transfer and R&D projects related to advanced microsystems packaging. We provide supports to the research activitiesin the unveristy.

Services

Wafer Level Processes
Chip/Package Level Processes
Board Level Processes
Material Characterizations & Inspection
Reliability Assessment
Failure Analysis
Optical/Thermal Characterizations
Simulations  

Facilities

Processing and Assembly
Sample Preparation
Material Characterization
Optical & Electrical Charaterization
Reliability Accessment
Failure Analysis

General Enquiry

Miss Justina Ko
Tel: (852) 2358 8356
Fax: (852) 2358 8357
Email: epack@ust.hk

Address:
Room 2162, Center for Advanced Microsystems Packaging,
Hong Kong University of Science and Techology,
Clear Water Bay, Kowloon, Hong Kong SAR

Visit Us

HKUST