Equipment Processing and Assembly

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4-zone Reflow Oven

Asahi

• Maximum board width: 300 mm
• Maximum board height: 23 mm
• 4 heating zones
• Temperature range: room temperature - 400°C
• Nitrogen reflow with oxygen concentration monitor

Categories

• Sample Preparation
• Processing and Assembly
• Material Characterization
• Opto-Electrical Characterization
• Mechanical Reliability Test
• Long Term Reliability Test
• Failure Analysis
• 3D printing

Equipment

• Wafer Saw
• Laser Wafer Scriber
• Manual Flip Chip Bonder
• Wire Bonder
• Transfer Molding Machine
• 4-zone Reflow Oven
• 6-zone Reflow Oven
• Vacuum Reflow Oven
• SMT Printer