Equipment Processing and Assembly
Wafer Saw
Disco DAD321
- Maximum wafer size: 6"
- Lateral resolution: 0.2 μm
- Operating speed: 0.1 ~ 300 mm/s
- Vertical resolution: 0.1 μm
- Amount left uncut: 0.0001 ~ 32 mm
- Angular resolution : 1.0" (angle)
- Spindle speed: 3000 ~ 4000 rpm