Electronic Packaging Laboratory
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Equipment
Processing and Assembly
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Equipment: Processing and Assembly
Automatic Dispenser
Camalot 1414
Maximum board size: 14" × 14" × 2"
Mechanical resolution: 0.001"
Drive system: lead screw dispensing
Applicable to solder paste, surface mount and conductive adhesives, and encapsulations (glob top and flip chip underfill)
Categories
Sample Preparation
Processing and Assembly
Material Characterization
Opto-Electrical Characterization
Mechanical Reliability Test
Long Term Reliability Test
Failure Analysis
3D printing
Equipment
Wafer Saw
Laser Wafer Scriber
Manual Flip Chip Bonder
Wire Bonder
Transfer Molding Machine
4-zone Reflow Oven
6-zone Reflow Oven
Vacuum Reflow Oven
SMT Printer