Equipment Processing and Assembly

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8-zone Reflow Oven

Heller 1808EXL

• Maximum board width: 560 mm
• Maximum conveyor speed: 1880 mm/min
• 8 heating zones + 2 cooling zone
• Temperature range: room temperature ~ 350 °C

Categories

• Sample Preparation
• Processing and Assembly
• Material Characterization
• Opto-Electrical Characterization
• Mechanical Reliability Test
• Long Term Reliability Test
• Failure Analysis

Equipment

• Wafer Saw
• Laser Wafer Scriber
• Manual Flip Chip Bonder
• Wire Bonder
• Transfer Molding Machine
• 4-zone Reflow Oven
• 8-zone Reflow Oven