Equipment Processing and Assembly
Automatic Flip Chip Bonder
Toray
- Maximum die size: 6 mm × 6 mm
- Minimum die size: 1.2 mm × 1.2 mm
- Maximum substrate size: 120 mm × 120 mm
- Alignment accuracy: 5 μm
- Maximum bond head temperature: 450 °C
- Maximum base table temperature: 150 °C