Equipment Processing and Assembly

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Solder Ball Bumper

Pac Tech

• Maximum size: 4" wafer
• Bond head for 100 μm and 300 μm solder balls in diameter (SnPb eutectic and SAC solders)
• Laser reflow of solder balls with/without flux application

Categories

• Sample Preparation
• Processing and Assembly
• Material Characterization
• Opto-Electrical Characterization
• Mechanical Reliability Test
• Long Term Reliability Test
• Failure Analysis
• 3D printing

Equipment

• Wafer Saw
• Laser Wafer Scriber
• Manual Flip Chip Bonder
• Wire Bonder
• Transfer Molding Machine
• 4-zone Reflow Oven
• 6-zone Reflow Oven
• Vacuum Reflow Oven
• SMT Printer