EPACK Lab is a R&D center in the Hong Kong University of Science and Technology (HKUST). We offer professional services and trainings to companies and industries. We cooperate with companies on technology transfer and R&D projects related to advanced microsystems packaging. We provide supports to the research activitiesin the unveristy.

Wafer Level Processes
Chip/Package Level Processes
Board Level Processes
Material Characterizations & Inspection
Reliability Assessment
Failure Analysis
Optical/Thermal Characterizations
Simulations  

Processing and Assembly
Sample Preparation
Material Characterization
Optical & Electrical Charaterization
Reliability Accessment
Failure Analysis